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IPC-Training-Manual-7711D-7721D

IPC 7711 / 7721

Rework, repair and modification Training of electronic assemblies

Targeting Excellence in Electronics Assembly

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Scope

The IPC-7711/7721 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.

How the IPC Certification Program Works

The IPC-7711/7721 Training and Certification program is 80% hands on. Candidates will be required to be experienced at soldering before taking this certification program. Candidates will be certified once they complete their course of study, passing the certification and practical examinations.

 

Program Benefits

 

Manufacturers and assemblers that want to realise dramatic cost savings by repairing and reworking electronic assemblies and printed circuit boards agree on the benefits of IPC-7711/7721, Rework, Modification and Repair of Electronic Assemblies.

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This widely used standard offers a wealth of industry-approved techniques on through-hole and surface-mount rework as well as land, conductor and laminate repair. It covers procedural requirements, tools, materials and methods for removing and replacing conformal coatings, surface mount and through-hole components. The standard also includes procedures for repairing and modifying boards and assemblies. In addition, it is now updated with additional support for lead-free, BGAs and flex-print repairs.

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Recommended for the following:

 

People Responsible for Repairs & Modifications of Electronic Assemblies. Click to see what level is best for me.

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Course certification:

 

Upon course completion students receive an industry recognised and traceable certification valid for two years.

CIT and CSE Certifications require all modules (below) to be completed. 

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Course duration:

 

5 days.

The available training from Clonfert Solutions

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  • Certified IPC Specialist-CIS

  • Certified IPC Trainer-CIT

  • Certified Standards Expert-CSE 

Course topics

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  • Module 1 – Common Procedures (Mandatory)

  • Module 2 – Wire Splicing

  • Module 3 – Conformal Coating

  • Module 4 – Through Hole

  • Module 5 – Chip & MELF

  • Module 6 – Gull Wing lead, SOIC/SOT, QFP & D-Pak

  • Module 7 – J-Leads

  • Module 8 – BGA Rework

  • Module 9 – Laminate Repair

For more information or to book a place on this course, please contact us or call us on +44 (0)1227 776 694.

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